SMC ZP2-T4010WNK50-06 Vacuum Pad – Oval, Vertical Vacuum Inlet with Buffer

The SMC ZP2-T4010WNK50-06 is a high-performance vacuum pad from the ZP2 Series, engineered specifically for handling rectangular, vertically or horizontally elongated workpieces with precision and reliability. This model features an oval, flat pad design that ensures optimal contact surface and stable suction.

Technical Details

• Pad Form: Oval flat type, designed to optimize vacuum contact with irregularly shaped workpieces.
• Pad Size: 40 mm x 100 mm approximate dimensions (typical sizes in the series); consult datasheet for exact sizing details.
• Mounting Types: Includes both male and female threaded fittings for versatile installation.
• Vacuum Inlet Direction: Vertical entry facilitates integration in space-constrained vertical assemblies or tooling setups.
• Vacuum Inlet Options: Male thread, Female thread, One-touch fitting, and Barb fitting available for flexible pneumatic connections.
• Buffer Feature: Equipped with a buffer mechanism providing a stroke of 50 mm to absorb impact and protect delicate workpieces, improving operational safety and pad longevity.
• Pad Material: Typically nitrile rubber (NBR) or comparable elastomers to resist wear and provide effective vacuum sealing.
• Weight and Dimensions: Approximate dimensions 19.05 cm length x 1.78 cm width x 13.46 cm height; weight approximately 1.5 kg, suitable for medium to heavy-duty vacuum applications.

Key Features

• Oval shape optimized for elongated workpieces, enhancing vacuum hold stability and reducing pressure loss.
• Buffer with ball spline mechanism ensures non-rotational stability and shock absorption.
• Supports vertical vacuum inlet to maximize spatial efficiency in machine design.
• Compatible with multiple vacuum inlet and mounting options, allowing custom configurations.
• Robust construction for use on heavy or large workpieces while preventing deformation during transfer.

Typical Applications

• Transfer of rectangular or large workpieces in automated manufacturing and robotic handling systems.
• Pick-and-place processes in electronics assembly requiring precise, non-marking grip on flat or curved surfaces.
• Glass substrate handling and delicate parts transfer where buffer stroke mitigates impact forces.
• Sheet metal, veneer, or corrugated board movement in packaging and material handling industries.

Datasheet & Additional Resources

For detailed technical specifications, dimensional drawings, and performance data, please refer to the official SMC ZP2 Series Vacuum Pad datasheet:

• SMC ZP2 Series Vacuum Pad Datasheet (PDF)