SMC ZP3-T10BSJ6-B5 ZP3 Series Vacuum Pad With Buffer Compact Type ?4??6??8

SMC ZP3-T10BSJ6-B5 Vacuum Pad from the ZP3 Series offers a compact, space-saving design optimized for efficient vacuum handling in manufacturing and automation applications. This vacuum pad features a pad diameter of 10 mm, suited for precise pick-and-place operations on small to medium-sized flat or gently contoured surfaces.

The model incorporates a buffer mechanism designed to absorb impact and reduce mechanical shock during handling, enhancing the longevity of both the vacuum pad and the workpiece. The buffer system supports strokes up to 20 mm depending on configuration, contributing to stable and reliable gripping performance.

For connectivity, it supports vertical vacuum inlet configurations and is compatible with one-touch fittings and barb fittings for ø2 tubing, facilitating quick installation and secure vacuum line connections. This reduces setup time and improves operational efficiency in tight or confined spaces.

Constructed with high-quality elastomer materials (options include NBR, FKM, silicone rubber), the vacuum pad ensures chemical resistance, durability, and reliable sealing under various environmental conditions. The overall length of the suction cup assembly is shortened relative to conventional models, yielding up to 75% space reduction and enabling integration into compact machinery designs.

Technical Highlights:

• Pad Diameter: Ø10 mm, compatible with a range from 1.5 to 16 mm in the ZP3 series
• Pad Types Available: flat, flat with groove, bellows
• Vacuum Inlet: vertical entry with buffer, supporting one-touch and barb fittings for ø2 tubing
• Compact Body: Overall length significantly reduced compared to ZP series, optimizing space usage
• Buffer Stroke Options: up to 20 mm, with short stroke types starting at 3 mm
• Material Options: NBR, FKM, silicone, urethane rubber, conductive variants
• Design suited for stable gripping on flat and lightly deformed surfaces

This vacuum pad is especially suitable for advanced automation systems, robotics, and assembly lines where miniaturization and reliability are critical. Its space-efficient profile and versatile connection options make it ideal for engineers seeking to enhance system compactness without compromising performance.